Used TORAY FC 3000L2 #9301158 for sale

TORAY FC 3000L2 bonder is an automated ultrasonic bonder designed for use in the fabrication of microelectronic components. It is typically used to attach two thermally-matched components together with a thin layer of polymer technology. The bonder is equipped with a visual alignment equipment and a high frequency, 3.5MHz transducer that produces a low-profile, durable bond. The transducer is adjustable and can be programed to match the specific bonding requirements of a particular application. The operator is able to program the bonder to bond a variety of different types of materials, including metals, plastics, adhesives, and solder preforms. This versatility provides the operator with the flexibility to bond a wide range of components and assemblies. The bonder is also programmed to produce bonds with very tight tolerances and extremely low development times, ensuring the components and assemblies produced are of the highest quality. FC 3000L2 bonder integrates a Series 1000 control system for programing and process control. This unit utilizes a Windows-based user interface and includes touch-screen parameters for easy setup and operation. The Series 1000 also includes a library of user-defined configurations, as well as pre-programmed bond parameter settings. The bonder also offers precise process monitoring and control, including off-line process monitoring, to ensure optimal production results. The bonder has an overall bonding-area of 150 mm x 150 mm, which can be easily adjusted with a hand wheel. The angle of the transducer is also adjustable, from 0 - 100 degrees, to ensure the optimal bonding conditions for a given application. The bonder is also equipped with an anvil stand, auto-leveling feet, and vibro-barrier for an even and secure bond. In terms of safety features, TORAY FC 3000L2 bonder has an interlocked front panel and door, and E-stop to ensure operator safety. A foot switch, control panel, and emergency shutdown machine are also included to provide additional safety. Additionally, the bonder is equipped with atomized motion control and a CCD camera, providing precise alignment and gap control. To ensure efficient and reliable operation, the bonder has easy access to tooling and components, and is compatible with TORAY PX8000 bonder-chip solution. The bonder also includes a waveform memory, permitting the operator to quickly program settings for the bonder. An assist-air nitrogen control tool is also included for cleaner bonds, and an auxiliary port is available for additional automation. Overall, FC 3000L2 bonder provides an efficient and reliable solution for the fabrication and assembly of intricate electronic components. It provides a high degree of flexibility and control, allowing for the fabrication of ultra-precision parts with a durable and high-quality bond. The vast array of features and safety features makes the bonder well suited for both mass-producing and prototyping applications.