Used TORAY FC-3500 #9239540 for sale

TORAY FC-3500 is a versatile bonder designed for applications that require a quick, efficient joining process. It is suitable for a variety of processes, such as thermosonic gold ball bonding, thermocompression gold ball bonding, and ultrasonic wedge bonding. This bonder can be operated manually or by use of an automatic program, allowing for the application of Force-Current-Height control as well as Force-Voltage-Height control. The machine uses a high-resolution vacuum wafer handling stage, providing the user with precise placement, as well as reliable alignment of the materials being bonded before the bonding process begins. Its advanced microprocessor control board allows for improved bonding accuracy and speed. The enhanced static force control also ensures that the force applied to the materials during bonding is consistent and free of any external vibrations. In addition, FC-3500 utilizes a high brightness video equipment for clear imaging and feedback control, which ensures that the bonding process is quick and efficient. This system also has built-in electrical test detection, which allows for an automated analysis of the bond before and after the process. The built-in lighting design ensures that the user can easily see the bonding area, and the monitor shows real-time data so the operator can monitor the bond as it occurs. There is also an E-OSD for operation optimization, which allows the user to set up desired parameters for the bonding process. Finally, TORAY FC-3500 is also equipped with a variothermal temperature control unit that enables the user to adjust the temperature of the bonding head and material holders, allowing for a more precise bonding process. It is also equipped with a flexible bonding head that can be adjusted up to 50µm, providing the user with maximum flexibility when selecting the optimum bond dimensions and adherence to application requirements. The integrated safety features ensure that the bonder is safe to operate, even when working with hazardous materials. Overall, FC-3500 is a versatile, efficient, and reliable bonder, perfect for any applications requiring a quick and efficient joining process. Its high resolution vacuum wafer handling stage, flexible bonding head, variothermal temperature control machine, enhanced static force control, and built-in electrical test detection ensures that the bonder is able to precisely and quickly bond a variety of materials, making it a great asset to any manufacturing environment.