Used TORAY FS 3500NS #9057217 for sale

TORAY FS 3500NS
Manufacturer
TORAY
Model
FS 3500NS
ID: 9057217
Vintage: 2009
Flip chip bonders Loader FC Bonding Dispensing Snack cure Unloader Currently warehoused 2009 vintage.
TORAY FS 3500NS Bonders are a class of high-precision, automated and semi-automated wire bonding machines that are used for thin-wire bonding applications. FS 3500NS Bonders are commonly used for a variety of electronic device packaging applications including semiconductor devices, hybrids and opto-electronic devices. TORAY FS 3500NS Bonders use either a Thermal Compression Bonding (TCB) or a Thermocompression (TCT) technology process. These technologies allow for the controlled formation of high-quality, stable bonds that are both mechanically and thermally reliable. This is accomplished using a combination of heat and pressure. FS 3500NS Bonders are equipped with several features for optimized operation and utilization. This includes a closed-loop control equipment that allows for the precision control of force, time and temperature. Additionally, the bonders have a real-time force-displacement sensor, which provides feedback on bond strength, enabling users to monitor and maintain bond quality. The system also includes advanced robotics capabilities that allow for a wide range of applications and process scenarios. These include a pick and place mechanism for loading components and a mounting platform for programming. Additionally, the controller can be set up for volume production, with automated job change and tooling management. Finally, TORAY FS 3500NS Bonders are designed to be easy to use and maintain. All of the unit's components are designed to be user-friendly, with a simple GUI and built-in diagnostic software to aid troubleshooting. The machine also comes with a full-featured active tool set that allows for easy maintenance and adjustment of tools and consumables. In summary, FS 3500NS Bonders are a highly efficient and reliable automated or semi-automated wire bonding tool that can be used for a variety of thin-wire packaging applications. The asset's closed-loop control model and advanced robotics capabilities enable precise and reliable control of the bonding process. Additionally, the equipment's user-friendly design and full-featured active tool set make it easy tooperate and maintain for optimized performance.
There are no reviews yet