Used TORAY OF 2000 #9241338 for sale

TORAY OF 2000 is an innovative bonding technology developed by the Japanese company, TORAY Industries, Inc. TORAY OF-2000 is an engineering solution designed to bond high-performance materials together for a range of automotive and industrial applications. OF 2000 uses a unique thermal bonding process which performs laser-induced, adhesive-less, thermo-compression bonding. This process is used to efficiently and effectively bond materials such as aluminum, stainless steel, magnesium, copper, titanium, and other non-metallic substrates including glass, plastic, and ceramics. The torch technology utilized by OF-2000 is powered by a highly efficient 5kW CO2 laser. The laser rapidly attaches thermal energy to the two substrates to be joined, providing melting and fusion of the joined area creating an extremely strong, reliable bonding solution. TORAY OF 2000 also utilizes a computer-controlled clamping system which isolates and secures the two materials that are to be bonded together. The clamping system enables accurately controlled temperatures and pressures along the bonded area, optimizing the bond strength and minimizing waste. This enables a reduction of the pre-bonding surface treatment costs associated with traditional bonding technologies. After completing the clamping process, the internal system then moves powerfully and accurately in order to precisely secure the joint. The resulting bonds that are created by TORAY OF-2000 have a high tensile strength of 2000MPa. Furthermore, the bond is extremely durable and permanent, making it ideal for applications in the automotive and industrial industries. The bonds created are also highly corrosion resistant, making them well-suited for highly demanding environments where longer lasting bonds are required. This cutting-edge bonding technology is cost-effective, reliable, and provides superior performance compared to other traditional bonding techniques. The combination of features ensures that theToray OF 2000 is a highly attractive solution for any application that requires a strong and reliable bond.