Used TSM TDB 526 #9393460 for sale

TSM TDB 526 bonder is a fully automated wire bonding equipment that is capable of performing multiple functions. It is suitable for use in manufacturing processes of varied component sizes and wire diameters. TDB 526 features an ergonomically designed user interface with a 10.4-inch TFT color LCD. It has a 7-inch LCD touch screen display, PLC I/O controller, power supplies for bonding operation, recovery timer, and USB drive. A bonding head is also integrated with the system and supports multiple wire diameters. The unit also offers an optional bonding range between 8 to 50 mm with 0.25 mm resolution, depending on the material and terminal. TSM TDB 526 employs a dynamic fusion bonding technique, with an ultra-fast cycle time of up to 4.5 second per unit. It is equipped with advanced bond monitoring and test systems including a bond monitor interlock machine, over-temperature detector, and an arc detector. This allows the OEM user to detect and respond quickly to any bond or repetition faults. The bonder also features multiple user profiles with configurable parameters, allowing users to optimize execution time and repeatability. TDB 526 is CE-compliant and UL-approved for safety. It is also environment-friendly and designed to generate minimal waste during operation. Moreover, it is compatible with all types of standard wire including gold, copper, and aluminum. It includes three utility software programs for working, editing, and carousel control. Through the use of these programs, the entire wire bonding process can be completely programmed. TSM TDB 526 is a reliable and precise machine for automated wire bonding processes. With its user-friendly interface, high-end features, fast cycle time, and safety compliance, it is an optimal solution for wire bonding processes in various industries.