Used TSM TDB 570 #9387300 for sale

TSM TDB 570 is a bonder designed for panel assembly and bench joining applications. This equipment is designed to reduce the time and effort required for manual bonding processes and improve the overall performance and efficiency of the assembly process. It is equipped with a wide range of features that make it ideal for a variety of applications. TDB 570 comes with a power source that has an output of up to 250 amperes with an adjustable output voltage range of 25-50V and frequency rate of 50-60 Hz. The power source is coupled with a ZV-Series solid state bond head providing precise control for a wide range of applications. The ZV-Series bond head is designed with integrated features such as linear track radius, quick-change nozzle, programmable spot time, and programmable bond time. TSM TDB 570 is a fully adaptive robot, meaning it can adjust to different materials and products, as well as accommodate various levels of automation. It also features an intuitive user interface system that allows for easy set up and operation. The unit also includes a programmable teach-mode that can be used to both create and execute a variety of different bond programs. TDB 570 is designed to be highly reliable and completely safe to use in a production assembly environment. The machine is equipped with numerous safety features, such as E-stop, protected tube guards, sensors and solenoids. It also has a variety of features that reduce the risk of shock, like integrated insulation, grounded base plate, and fusing. Overall, TSM TDB 570 is an efficient and reliable bonder for panel assembly and bench joining applications. Its wide range of features make it a great choice for a variety of industries, while its intuitive user interface and safety features make it an ideal tool for any production environment.