Used TSM TSK570 #9390259 for sale

TSM TSK570 is a dispersion-style, thermosonic wire bonder designed for use with a variety of different wire sizes and materials. TSK570 is specifically designed to handle both gold and aluminum wire bonding. It has two servo-controlled die attach heads, one for each wire size, and two heated adhesive systems that can be programmed for up to 200 different recipes. TSM TSK570 also has a built-in inspection equipment which provides real-time 3D imaging of wire bonds to ensure they are within specified parameters. The wire bonding speeds of TSK570 are highly reliable and consistent with a maximum speed of over 550 bonds per second. It features a precision 5-axis positioning system and has two independent attach heads that can be programmed to simultaneously bond wire bundles up to 8mm in diameter. The wire bonding head also has a vacuum-assisted pick-up unit which ensures that the wire stays aligned and properly tensioned during bonding. Additionally, the die bonder has static and dynamic servo axes for precision and quick tracking of the wire bonding head. In addition to the features mentioned above, TSM TSK570 also features a wide variety of customizable settings. It has a user-friendly graphical interface that allows operators to program custom settings for each bond type such as applied pressure, time, and temperature. It also has a built-in measurement machine for measuring wire lengths and has two built-in ultrasonic power modules that can be used to deburr wire edges and remove small beads or debris. TSK570 bonder is a highly versatile and user-friendly wire bonding solution that provides reliable results. It is capable of accommodating a wide variety of wire sizes and material types and offers a number of customization options and features that make it easy to use. With an inspection tool that provides real-time 3D imaging of wire bonds and the ability to bond wires up to 8mm in diameter, this machine is capable of meeting the needs of virtually any wire bonding application.