Used TSM TSK571 #9387295 for sale

TSM TSK571 is a versatile bonder that has a wide range of applications in industries such as electrical engineering, automotive, chemical, robotics and others. It is a type of solder reflow equipment and is able to bond materials with a wide range of thermal, physical, chemical and electrical properties. The bonder features a large working area for a wide range of materials to suit the application and a built-in overheat protection equipment to ensure reliable and safe operation. The bonder has several features that make it suitable for various types of processes. It is equipped with a microprocessor-controlled temperature controller and thermocouples for precision temperature control. The bonder features a dual-track system with two independent processing chambers, allowing two different materials to be bonded simultaneously and improving production efficiency. The operator is also able to change the temperature of each processing chamber independently. The bonder has a panel-like design and includes an advanced process control and monitoring unit. TSK571 has a 30 pre-set programmable parameters including temperatures, dwell times and speeds that can be used for producing consistent and reliable results. Additionally it has a solder paste dispenser and a vacuum machine that helps create homogeneous bonds. The adjustable parameters make the bonder suitable for a wide range of materials and applications, such as copper, aluminum, PCBs, stainless steel and more. TSM TSK571 is also a cost-effective solution with a small, lightweight and space-saving design. It has an efficient circulation and cooling tool, which helps maintain a consistent temperature in the processing chamber and improves overall performance. The bonder is easy to operate with user-friendly interface and controls making it the ideal machine for both large and small scale production.