Used UNITEK 08-150 #9187158 for sale

UNITEK 08-150 is a robust, professional grade hot melt adhesive/bonding equipment designed for applications where high strength and reliability are needed in a small, lightweight and affordable package. With adjustable temperature and speed controls, 08-150 is capable of bonding a variety of materials in numerous applications. UNITEK 08-150 features a powerful, dual-stage magnetic drive motor and a simple pressure control system. The motor is designed to operate up to 15,000 RPM and offers adjustable speed settings for different types of job requirements. The pressure control unit provides an adjustable range of 0-15,000 PSI to ensure reliable bonding of materials. One of the most important features of 08-150 is its integrated safety machine. This tool includes a temperature monitoring asset which shuts the machine down if temperatures outside its operating range are detected. The model also includes a thermal fuse which prevents the machine from operating if temperatures are too high. Additionally, UNITEK 08-150 is deemed to be an intrinsically safe device and is certified for operation in hazardous worksites. 08-150 comes complete with a robust heating element and a range of tools and accessories. The heating element is designed to achieve optimal hot melt adhesive performance while the tools and accessories provide the operator with the necessary flexibility when working with a variety of materials. Other features of UNITEK 08-150 include a durable steel frame, a highly visible LCD display and a one-year limited warranty. The LCD display shows all the necessary operating parameters, making it easy for the operator to monitor and adjust the machine's performance. 08-150 is an essential tool for a wide range of applications which require the strength and reliability of hot melt adhesive. With the combination of adjustable speed and temperature settings, a robust motor, integrated safety equipment and range of tools and accessories, UNITEK 08-150 is a reliable and cost effective bonding solution.