Used UNITEK MICROPULL I #9020472 for sale

UNITEK MICROPULL I is a fully automated precision die bonder that is capable of handling a wide range of applications, from the micro welding of thin wires to the mid-level assembly of complicated components. It features the highest level of accuracy and performance available on the market, with unmatched precision and speed. This die bonder is designed to ensure fast and accurate bond formation and can handle a wide range of materials used in a wide variety of applications. MICROPULL I uses a precision two-axis system to accurately position and align components to be bonded. It also has a vision-guided system that offers precise alignment and machine vision integration such as checking for foreign objects or measuring and inspecting bonding points. The bonder also provides the ability to set precise pressure, time and temperature settings, ensuring even bonds throughout the production. The unit includes a built-in thermal profiler that can capture and analyse temperatures across the bonding points to ensure repeatable and consistent performances. UNITEK MICROPULL I has an overall cycle time of 3-5 seconds and is capable of achieving bonding points from 10 microns to 50 microns, while providing bond type flexibility with options such as wire, ribbon, and die attach. Its monitoring system provides a detailed history of bond formation and performance while also verifying the process parameters at each bond point. MICROPULL I is also user-friendly, as the operator-friendly ergonomics and intuitive touch screen programming makes it easy to use and maintain. It also offers a compact benchtop design with a compact footprint to provide flexibility of space. Overall, UNITEK MICROPULL I is an automated precision die bonder designed for fast and precise bonding of a wide range of materials across a variety of applications. Its cutting-edge technology and easy-to-use design makes it a suitable solution for any project requiring precise bonding.