Used UNITEK MICROPULL III #293748463 for sale

UNITEK MICROPULL III is an advanced, high-performance wire bonding tool that is designed to reduce overall cost and improve product quality for a wide range of wire bonding applications. It is equipped with advanced technologies, such as a unique Ultrasonic/Hotbar hybrid technology, as well as advanced control technologies that provide superior wire pull strength compared to traditional wire bonding solutions. The machine is equipped with automatic programmable Ultrasonic or Hotbar mode switching, advanced "push" manipulation capabilities, and fully programmable scalability. The unique "Ultrasonic/Hotbar hybrid technology" enables the machine to rapidly adjust process parameters and parameters associated with temperature control, to ensure the highest possible wire pull strength and minimum bond damage. The advanced Ultrasonic or Hotbar mode switching can be programmed to automatically switch between modes according to the specific bonding conditions, providing the best possible combination of bond toughness and pull strength. MICROPULL III features an array of advanced features, such as "push" manipulation capability which enables automated manipulations of wire during and/or after wire bonding, allowing for a higher degree of precision and increased flexibility for various types of wire bonding process. The machine is also equipped with fully programmable scalability, which offers high performance in a very compact size, providing a cost-effective solution for a variety of demanding wire bonding applications. UNITEK MICROPULL III is designed with a high degree of process control and robust vision techniques in order to ensure maximum reliability. This machine is ideal for production of high yield and high quality surface mount, through-hole, chips, air bridge, ribbon, and coaxial bonds. Additionally, it can be used for a wide spectrum of materials, including copper, aluminum, and gold. Overall, MICROPULL III is a highly advanced, high-performance wire bonding machine designed to reduce overall cost and improve product quality for a variety of wire bonding applications. It features a number of advanced features, such as Ultrasonic/Hotbar hybrid technology, "push" manipulation capabilities, and fully programmable scalability, making it a great choice for demanding wire bonding applications.