Used UNITEK MICROPULL III #83250 for sale

UNITEK MICROPULL III is a modern and advanced bonder designed to deliver fast and precise bonding functionality for polymeric substrates. Developed with a range of sophisticated technologies and tools, the bonder facilitates both hot and cold bonding processes involving polymers, films, and other materials. The bonder includes a unique heating element for quick and accurate heating of the materials prior to bond formation, enabling thorough thermal control for uniform and total bonding. The temperature range is adjustable from room temperature to a maximum of 350°C, and the pulse technology used for the heating ensures uniform heat distribution as well as increased process reliability. The high-precision displacement control allows for accurate positioning of the components that need to be bonded. The process control is achieved through a digital display that offers higher accuracy and ease of use. The low-loss x-y driver technology offers superior positioning control and accuracy with minimum drift, thereby promoting better process repeatability. The bonder is equipped with a direct drive mechanism to ensure consistent and reliable operation. The direct drive mechanism allows the bonder to operate at higher speeds with minimal vibration and wear. Additionally, the motor is designed to ensure long-term operation and output power stability, thereby making it an ideal choice for bonding processes. The bonder has three process modes to suit any bond requirement - hot, cold, and mechanical. The combination of these modes allows for a wide range of characteristics to be achieved, including high bond strength, chemical resistance, and durability. Additionally, the mechanical mode allows for directionless bond formation via mechanically aligned bonding tools. The peeling force feedback system used in the bonder is another unique feature that offers excellent reproducibility and high controlling accuracy. In addition, the ultrasonic peeling frequency detection allows for more accurate detections and improved reproducibility of the bonding process. MICROPULL III is believed to be one of the most technologically advanced bonders in the market today, offering superior functionality and improved process accuracy. With the ability to effectively bond almost any material, it is the ideal choice for any and all bonding needs.