Used UNITEK MICROPULL III #83251 for sale

UNITEK MICROPULL III SEMATECH Bonder is a precision wire bonder specially designed for the fabrication of high-performance microelectronic devices. The equipment is engineered to support a wide range of application requirements, including thermocompression, thermocompression with ultrasonic bonding, and eutectic bonding for various microelectronics and optoelectronic devices. The bonder offers precision wire-bonding capability in both single and multiple axis configurations, designed to optimize the process of wire bonding on all types of materials, including copper, gold, aluminum, copper-aluminum, and Platinum-gold. MICROPULL III features a pressure-controlled, pull-lever actuator that ensures consistent wire pull and tension, improving the bond integrity, increasing yield and lowering manufacturing cost. Additionally, the bonder is equipped with a technique independent, matrix-like robot patterning mechanism, ensuring reliable and accurate bonding patterns, with a resolution of 60micron. The system offers multiple bond heads for process flexibility, a full color graphical user interface for easy operation, an ultra-low front of pattern for improved visibility, and automatic work acceleration and deceleration for precision motion control. It also includes an integrated ultrasound transducer, an electromechanical shock absorber, and a patented FormalFlex™ Sensor and integrated software that protect delicate die and bond wire during bonding. UNITEK MICROPULL III is designed to meet the rigorous demands of industrial and research components, including MEMS and optoelectronics, with excellent reliability and quality assurance. MICROPULL III is compatible with numerous closed-loop control algorithms and communication protocols, providing superior accuracy and high throughput. It is equipped with high-performance PLCs, servo motors, and software, ensuring high repeatability, accuracy, and stability. Additionally, the integrated auto calibration unit further optimize process parameters and ensure highest output quality, while the remote maintenance machine allows for convenient, remote troubleshooting and maintenance. UNITEK MICROPULL III is a flexible and reliable bonder for various microelectronics devices, offering a high level of process control and repeatability. Its accuracy, speed and reliability make it an ideal choice for a wide range of microelectronics applications.