Used UNITEK MICROPULL III #9117210 for sale

UNITEK MICROPULL III bonder is a state-of-the-art advanced bonding system for manual bonding tasks with sub-micron accuracy. It utilizes the direct pull of a bonded metal specimen to measure adhesive bond strength. Using the direct pull of a bonded metal specimen, it brings the measurement speed to a level that is not attainable with traditional mechanical testing methods. MICROPULL III package includes a powerful on-board microprocessor and a captivating graphical user interface. The main features of this bonding system include miniature footprint, cost-effective hardware design, and USB communication. The bonder uses a precision loadcell to measure up to 1 kg of force, which makes it suitable for bonding substrates with a force up to 10 kg. The frame design of the unit is lightweight and flexible, allowing easy movement in tight spaces. In addition, it has the ability to measure bond strength from 0.1 to 10 MilliNewton with a resolution of 0.1 MilliNewton. The onboard processing chain also includes a micro switch sensor for precise positioning and a digital display with 0.1 mV to 0.9 Volt resolution. It has a temperature resistance up to 1050°C with a loading speed of 1 meter/second. Equipped with a sturdy and adjustable arm, UNITEK MICROPULL III also allows for batch-mode bond tests. This feature enables convenience and versatility, resulting in faster and more accurate testing for many different combinations of substrates, adhesives and curing processes. The bonder also comes with a built-in support for SEM imaging of surfaces of bonded specimens. MICROPULL III bonder is an ideal choice for low-gravity and stress-resistance testing. Its compatibility with existing laboratory testing equipment and its user-friendly interface have maintained its popularity among researchers, scientists, and industrial service providers. The bonder is also RoHS certified for environmental safety. Overall, UNITEK MICROPULL III is a powerful and versatile bonder for manual bond testing. With its user-friendly interface and various advanced features, it allows researchers and laboratory personnel to enhance their testing capabilities and evaluate their bonding samples with unrivalled speed and accuracy.