Used UNITEK MICROPULL III #95881 for sale

UNITEK MICROPULL III bonder is an advanced microelectronics assembly fabrication equipment designed to provide high quality wire bonding results and excellent assembly yield. It is an ideal solution for high-volume production applications. MICROPULL III bonder features a wide range of features and is built for speed and accuracy. The bonder's x-y workhead allows for precise placement of bond wires and leads within a 5mm or 10mm working field and can handle a variety of different wire diameters up to 0.5mm. The system is equipped with a high-precision, high-frequency HFDC (dual-waveform technology) feeder for wire feeding, conditioning and tensioning control. The bonder also includes an integrated cast body and OCR monitoring unit for reliable and efficient production. Thanks to the dual-modulated pulse pull machine (DMPS), UNITEK MICROPULL III bonder provides superior reliability in the wire pull tests with minimal stress imposed on the components. MICROPULL III bonder is equipped with a 3-axis motion stage with a precision of 0.01mm accuracy, ensuring that placements are exact. The bonder also features a high-speed lay-down mode that makes it easy to bond tight pitches and surfaces. The bonder also features a full automatic calibration tool with optional vision asset to monitor its performance and improve productivity. The vision model can be set up to identify wire placement, conductor lifts, and multiple pathways during the bonding process. Supply chain compatibility is supported with a wide range of rack-mountable fixtures and quick-connect terminal blocks for easy installation and upgrade. The tear-down time for changeovers is very low and a wide range of optional accessories including specialized tooling and consumables can be purchased to maximize its potential. UNITEK MICROPULL III bonder supports various production test options to ensure the highest quality product performance. Overall, MICROPULL III bonder is an ideal solution for high-volume production with reliable wire bonding results and excellent assembly yields. The full range of features, customizable settings, and process support makes it a great choice for a wide range of microelectronic assembly fabrication applications.