Used UNITEK MICROPULL IV #139018 for sale
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ID: 139018
Bond wire puller
Bausch and Lomb microscope with DHF device holder
100g unit
RS232
20x Olympus eyepiece
3x - 60x zoom capability.
UNITEK MICROPULL IV Bondiing Equipment is an automated and reliable bonding system, designed to meet the needs of industry-standard fine-pitch and high-density wire bonding applications. It is ideal for manufacturers working on applications of ultrafine wire bonding due to its high accuracy, fast cycle times and low cost of ownership. MICROPULL IV Bondiing Unit utilizes a patented backside force/pull loop technology, which yields superior process accuracy and repeatability. The machine is capable of a 6 second cycle time, achieving less than 10% pull force variation and a 95% inspection result accuracy. The unit is operator-friendly, featuring a graphical user interface, enabling programming and control functions with a few simple clicks and keystrokes. It is customizable, allowing users to tailor configurations and settings to their specific manufacturing requirements. Additionally, UNITEK MICROPULL IV Bondiing Tool offers an optional patented wire looping technology, as well as an expandable squeegee asset, wireless inspection solutions and an IR 940 & IR 950 wire guide model. MICROPULL IV Bondiing Equipment features a unique pull loop technology that precisely controls pull force and guarantees constant force throughout the fabrication process. This precision allows for faster cycle time, better throughput and increased process stability. The system also features an adjustable pull distance and pull height, as well as adjustable tension and resistivity testing. UNITEK MICROPULL IV Bondiing Unit is designed with a modular frame concept that provides stability and durability, enabling precise and precise alignment of boards and components. The user-friendly graphical user interface enables users to easily switch to different job programs and configure for different bond lengths and loop sizes. Additionally, the machine offers integrated computer vision and an automated puller for precise process control and high-level defect detection. MICROPULL IV Bondiing Tool is built with the latest in automation systems, resulting in advanced process control and consistently high throughput. The asset is dedicated to end-to-end manufacturing, from the host machine to tooling, ovens, and sensors. The user-friendly graphical user interface and expandable model architecture provide users with the ability to configure and optimize processes in order to achieve higher product yield and quality. Additionally, this equipment is ideal for applications in photovoltaic, medical, semiconductor and other advanced industries, due to its wide range of features and capabilities.
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