Used UNITEK MICROPULL IV #85246 for sale

UNITEK MICROPULL IV Bonder is a fully automated, microprocessor-controlled, vacuum-controlled thermal bonding equipment designed to heat and secure tiny parts accurately and reliably. This device is highly efficient and precise with its unique 4-dimensional bonding technology and provides a consistent, reliable bond. MICROPULL IV has the capability to bond wires and components with a sub-micron resolution, which allows for precisely controlled bonding between tiny wires and components. The system utilizes precision setpoint circuitry and utilizes a patented, wafer level micro vacuum unit to tightly control part movement relative to the pad. With this patented, wafer-level control, temperature and pressure are accurately monitored, simplified setups and operation, and real-time tempeature control. This compact, easy to use device has a broad temperature range (150-400°C) and is compatible with a multitude of materials. It is capable of handling a number of different wire sizes and heights, including 0.0003" to 0.032", and has a maximum pull force of nearly three pounds. The device is equipped with a 7-inch touch screen control panel, which makes it easy to operate and program. UNITEK MICROPULL IV's integrated optical microscope allows viewers to zoom and focus on the actual bond process, which can be extremely beneficial for diagnostics and troubleshooting. This device also has an integrated thermal chamber for managing the environment for optimal bond formation. This chamber maintains optimal thermal uniformity, preventing hot or cold spots, which can affect the bond quality. Finally, this device has a variety of bond head options, allowing for the bond head to be customized to the customer's requirements. Overall, MICROPULL IV Bonder is a highly efficient and precise bonding machine that offers precise control and reliability. With its patented micro vacuum tool and thermal chamber, the this device successfully creates highly precise bonds between wires and components with a high degree of accuracy. This device is a great addition to any automated production line, as it offers reliable and precise bonding with a broad temperature range and maximum pull force of nearly three pounds.