Used UNITEK MICROPULL IV #9020584 for sale

UNITEK MICROPULL IV Bonder is an automated die bonding equipment used to attach die to substrates, for applications that require very fine precision and absolute accuracy. This system is designed to bond die on substrates for many uses, including photoelectric sensors, laser diodes, RF components, and semiconductor packages. This bonder features a highly accurate vision unit, utilizing state-of-the-art imaging technology and highly accurate algorithms to ensure perfect placement of die on a substrate. It also includes an automated die positioning machine that allows the user to precisely place die in their desired orientation. The die alignment and positioning is done entirely by the machine, reducing the need for manual handling of the die, which can cause damage to the delicate components. MICROPULL IV bonder is capable of both fine-pitch and ultra-fine-pitch bonding. It is equipped with an ultra-precise XYZ robotic arm, that is capable of precise robotic movements in progressions of 0.1 micron increments. This unique feature allows the bonder to bond die with pitch rates down to 10 microns or less. This critical accuracy makes the tool ideal for high-precision devices such as photoelectric sensors and laser diodes. This asset also comes with advanced temperature control and heat distribution capabilities. The temperature of the bonder's heating cartridge can be precisely controlled to reliably heat and cool the die and substrate, ensuring that the correct bond line temperature is applied for each bond. UNITEK MICROPULL IV Bonder is also equipped with a control model designed to provide feedback to the user and adjust the parameters of the bonder as needed to create the perfect bond., such as die size, bond pressure, and time. MICROPULL IV Bonder is an automated equipment designed to offer users highly precise die bonding for a wide range of applications. Its advanced vision system allows the user to pre-align die onto substrates with precise accuracy, while its robotics arm make it easy to perform ultra-fine-pitch and fine-pitch die bonding. Its temperature control unit and feedback features provide the user with a comprehensive machine for creating and maintaining perfect bond lines. This tool is an ideal choice for anyone needingreliable and accurate die bonding capabilities.