Used UNITEK MICROPULL IV #9260712 for sale

UNITEK MICROPULL IV is an advanced, semi-automatic die bonder designed for microelectronic assembly processes. It is equipped with a vision equipment to locate and precisely align small die and devices to a substrate and bond them using a combination of heat, pressure and ultrasonic force. MICROPULL IV is constructed with a C-Frame chassis and linear servo stages to ensure precise and repeatable alignment and placement of parts into a die-attach pocket. It is capable of handling parts ranging from 0.080 mm to 10.0 mm in length. The placement accuracy of the die bonder is within 5-7 um, and total process cycle time can be as fast as 3 seconds. The system is capable of bond heights from 1-20µm, and pull force can range from 0.2g-20g. The placement pressure can be adjusted up to a maximum of 120N or 11kg, and the temperature of the bonder can also be adjusted up to a maximum of 350°C. The unit is capable of a total of 10 programmable test sequences and hot swap of bond and pull modules. UNITEK MICROPULL IV is designed to perform reliable and repeatable die bonding and encapsulation with no damage to parts. MICROPULL IV is designed to increase throughput, improve product quality, and reduce costs associated with microelectronic assembly. Its two-axis motion control and use of a vision machine make it ideal for automated assembly applications, and its software is user-friendly and designed for simple operation. The tool is equipped with a range of safety features including a die bond monitor and a fault log to ensure safe operation of the asset. It is also designed with removable maintenance panels and a USB port for data transfer and program updates. UNITEK MICROPULL IV is an ideal choice for die bonding and encapsulation of high-density electronic components in applications such as medical, aerospace, and automotive electronics. Its advanced features, fast cycle time, and excellent repeatability provide a precise, reliable and cost-effective bonding solution for a variety of microelectronic assembly processes.