Used UNITEK MICROPULL V-DL #9020471 for sale

UNITEK MICROPULL V-DL represents the latest micro pull-bonder technology available for die attach applications. It is a high precision machine equipped with a double lump die handling module, allowing for both backside and the second lump to be handled at the same time. MICROPULL V-DL has a wide range of bond force settings from 25 to 120gf, adjustable by 1gf increments. This enables users to precisely match the bond force to the desired amount for each component. In addition, the machine is capable of using different types of thermosonic die attach material including indium, silver, and gold. UNITEK MICROPULL V-DL utilizes an advanced vision system for precise die position and placement. The wafer-level system is designed to maximize accuracy and minimize cycles by allowing operators to attach dies in multiple orientations with just one setup. The machine also features high speed alignment and has a large workspace with independent operator facilitation. This helps operators quickly and easily load and unload die packages with minimal stoppage. MICROPULL V-DL also boasts a user-friendly interface which is easy to learn and navigate, allowing for quick setup and bidirectional communication via USB connection. UNITEK MICROPULL V-DL is a reliable and user-friendly die attach machine, offering precision and accuracy in its operation. The machine is fast and efficient, with a cycle time of just 8 seconds, making it perfectly suited for today's high volume production. Additionally, the die attach machine has numerous safety features, such as an onboard air exhaust fan and temperature monitoring. The fan ensures accurate temperature control and the correct pressure at all times, which helps to minimize contamination and improve overall cycle time. In conclusion, MICROPULL V-DL is a superior die attach machine offering maximum accuracy and precision with minimum downtime. Its wide range of force settings, high-tech vision system, and user-friendly interface make it ideal for almost any die attaching application. This bonder is second to none and is sure to fulfill the needs of any company with high volume production requirements.