Used WEHEN AG 5200 #9383460 for sale

WEHEN AG 5200 is a high performance industrial bonder designed to provide fast and repeatable bonding, potting, and encapsulation processes for a broad range of applications. It features a user-friendly touchscreen interface providing an intuitive and easy-to-use experience. AG 5200 offers a variety of combinations of temperature profiles, widths, and speeds to meet even the most challenging of applications. This bonder is capable of providing precise bonding, sealing, coating, and dielectric underfill solutions for circuit boards, encapsulating applications, and optical components. The bonding head features a floating head with zero clearance for improved repeatability and the ability to bond ultra delicate components. Its integrated design also helps to reduce footprint and overall size. WEHEN AG 5200 is features gas assisted heating for consistent temperatures throughout the nozzle orifice and a thermocouple for temperature feedback for accuracy. Its advanced timing circuitry helps ensure repeatable process times, while its integrated light source helps detect lid opening and closing for process control. It also features an adjustable orifice size to provide more accurate control of the bonding process. AG 5200 is designed for safety and energy efficiency. It has a cold nozzle start-up feature that further protects delicate components from thermal stress. It also features a shutoff timer and auto shutdown feature, as well as adjustable airflow. The machine is housed in a steel frame construction for ultimate protection and longevity, and has a contemporary design to fit into almost any facility. To further ensure accuracy and repeatability, WEHEN AG 5200 also features an integral software interface that helps to quickly control all process parameters, including temperature control, process time, process speed, and temperature profile. Its flexible open-system programmability allows users to quickly create and save recipes for later use, as well as to transfer and analyze data for production optimization. AG 5200 is an outstanding bonder for a variety of industrial applications. Its advanced features and user-friendly interface provide an efficient and repeatable bonding solution for the most delicate components. With its robust construction, safety features, and software programmability, it is an ideal choice for achieving optimal process performance for many applications.