Used WESTBOND 35363730F-90 #9238965 for sale

Manufacturer
WESTBOND
Model
35363730F-90
ID: 9238965
Wire bonder Ball bond head installed 90° Feed deep access wedge bond head 3-Way convertible 45° feed wedge bond clamps.
WESTBOND 35363730F-90 is an electrical bonder used for bonding electrical components to the printed circuit board (PCB). It is a modular equipment with a wide variety of parameters, allowing the bonding process to be customized according to the application. 35363730F-90 is a four-head bonder, and has a process speed of up to 120 cycles per minute. It is equipped with a 3-axis robot arm that ensures accurate placement of the components during the bonding process. This model also features a fully automated vision system with an adjustable zoom range of 1 to 10x magnification, and adjustable vision algorithm settings to optimize the vision detection accuracy. WESTBOND 35363730F-90 has several bonding capabilities, including copper-to-copper bonding, gold-to-gold bonding, and aluminum-to-aluminum bonding. This model features a pneumatic bonding head that can be used for both standard and micro-bonding applications. This bonder's temperature control unit ensures a consistent temperature throughout the bonding operation by monitoring and adjusting the temperature at the point of bonding. The temperature range is adjustable from ambient to 180°C (356°F). 35363730F-90 also comes with a vacuum microscope that can be used to check the accuracy of the bonding process and the quality of the bond. This bonder's mechanical stability is ensured through a stabilize force-balanced machine that corrects any micro-movement of the bond heads to ensure precise process control for each bond. It also has a thermal cut-off tool that sounds an alarm if the temperature of the bond joints exceeds 180°C. WESTBOND 35363730F-90 bonder is an advanced and reliable machine that provides fast and accurate electrical component bonding results. Its user-friendly interface allows the user to easily select the parameters and program the desired bonding process. It is suitable for both small-scale and large-scale production lines. This bonder is ideal for high-precision applications and provide excellent results in a short period of time.
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