Used WESTBOND 4500 #9238967 for sale

WESTBOND 4500 is an advanced automatic wire bonding machine that integrates a patented Micro-Ball and / or Force-Feed Multi-Wire bonding process. This wire bonding process is suitable for applications requiring high product outputs at a low cost, and where rapid and precise reliable bonding of wires is critical. 4500 combines a motorized stage and an embedded precision ball manipulation system, allowing for high speed and accuracy during the bonding process. Micro-ball bonding technology helps to increase throughput by speeding up the bond process and providing more accurate placement. Additionally, it allows for optimized wire placement and fewer wire bridge segments as it locks in faster processing speeds and higher precision. In wire bonding, the multiple wires are released from the wire sweep mechanism and transported to the bonding site on designated pins. This ensures consistent and accurate positioning and enables faster wire bonding with higher quality. WESTBOND 4500 also features a Force-Feed Multi-Wire bonding process, which takes advantage of pressure applied to the wire wraps for reliable and repeatable bonding. This process involves the use of a special tool head that precisely applies the external force on the wire loop and wraps the loose wires around the pins. With this process, the wire is gently pulled into the bonding site with a predetermined force, ensuring a solid and secure connection is formed. The spring wire profile is precisely controlled to optimize the force applied to the wire wrap without damaging it, resulting in reliable and high-quality electrical connections. Moreover, 4500 enables batch process wire bonding, allowing up to thousand wires to be placed in a single bonding sequence. The process can be configured to accommodate tightest loop size and spring thru-rolls that fail the standard loop test, enabling users to control wire placement and loop quality. In summary, WESTBOND 4500 is an automated wire bonding machine with Micro-Ball and Force-Feed Multi-Wire bonding process that offers reliable, precise, and efficient bonding of multiple wires quickly and with high accuracy. These features assist in reducing overall costs and improve the quality of the product being manufactured.