Used WESTBOND 7200 #9187154 for sale

WESTBOND 7200 is one of the most advanced and reliable bonders available. It is the benchmark in advanced high-speed bonding technology, designed to meet the demanding needs of the latest printed circuit board assembly processes. It offers unparalleled power and agility for high-performance bonds, in combination with process flexibility and repeatability. 7200 runs in continuous motion over two-sided boards, significantly reducing cycle time and improving overall component and board placement yield. It is a flexible and highly reliable bonding equipment that is rated to exceed 3 billion bonding cycles and is modular enough to easily adjustable for future needs. WESTBOND 7200 can handle a wide range of board types and sizes for both single and multi-up boards, providing the perfect solution for both small and high-volume production needs. 7200 is equipped with an advanced digital pulse control system which enables maximum power and speed through the use of patented micro-electronic based unit technology. This machine also features an integrated vision tool which allows the asset to accurately identify boards and components, enabling quick, reliable and accurate placement. WESTBOND 7200 is also capable of soldering, utilizing its Pulse Cascade soldering technique during the assembly process. This technique increases soldering productivity, improving accuracy while still minimizing the possibility of damage to sensitive components and boards. 7200's soldering also has the advantage of being extremely energy efficient, as its active scanning combined with low-current settings dramatically reduces power consumption. WESTBOND 7200 uses a range of button and touch-screen interactions to control the bonding process. Its modern design enables users to easily setup process parameters and activate preset processes with the touch of a button. 7200 is also equipped with a sophisticated data logging feature which allows users to track and analyze production data. Overall, WESTBOND 7200 is an extremely reliable and highly engineered advanced bonder designed to meet the most demanding needs of today's printed circuit board assembly processes. Its flexibility, precision, and power make it an ideal choice for all types of high-performance bonding applications.