Used WESTBOND 7200AT #9388539 for sale

WESTBOND 7200AT is a bonder designed for a variety of applications, including chip assembly, lead frame bonding, printed circuit boards, and many other types of microelectronic device assembly. It is a fully programmable heated bonder with high accuracy and repeatability. The machine has a very fast response time, allowing it to make the necessary bonds quickly and accurately. The application specific design of 7200AT is tailored to suit the exact requirements of the customer. It features a range of options to maximize productivity and minimize waste, including automated glue, permanent, and vacuum bonding. The control panel is easy to use and can be adjusted to create the ideal bond strength and accuracy. The advanced design of WESTBOND 7200AT allows for the rapid and accurate application of wire, ribbon or film bonding, and its flexible handling equipment ensures that the device can be quickly changed without any disruption to the process. It also features a standard pressure and temperature control system with over-temperature protection and maintains the temperature and pressure with a 'closed-loop' control unit. 7200AT uses a unique bonding material which has been specifically designed for microelectronics to ensure maximum bond strength, adhesion, and reliability. An array of characterizing parameters are monitored to ensure that the device is in complete and perfect working condition, such as the bond head temperature, glue temperature, and force. WESTBOND 7200AT bonder is also designed with maintenance and safety in mind. Teflon bonded parts can be removed with the help of a built-in field de-magnetizing machine, and the tool is designed to minimize risks such as sparking, contamination, and over-heating. The machine is also designed to meet and exceed the applicable safety standards. Overall, 7200AT is an excellent bonder which is perfect for a variety of microelectronic device assembly applications. Its user friendly design and its range of features make it a fantastic tool for bond assembly, lead frame bonding or printed circuit boards. It delivers high accuracy and repeatability, as well as providing maximum bond strength and reliable installation.