Used WESTBOND 7200B #293627288 for sale

WESTBOND 7200B Automatic Wedge Bonder is an advanced automated flip chip bonder. It is an ideal solution for high-volume production lines as it is reliable, robust, and easy to use. Its simple design ensures efficient throughput and low maintenance costs. The machine is capable of wedging fine-pitch and ultra-fine-pitch bond wires of 21 mils and below for applications such as mems, sensors, and microprocessors. The bonder is equipped with an integrated vision system that ensures accurate wire placement and an electronic image feedback system that further supports precise wedging. Additionally, the bonding head is equipped with advanced stress control to avoid deformations and ensure optimum wire placement. For added flexibility, 7200B comes with various pattern clamps that can accommodate common and customer-specific PCB layouts. Moreover, it is capable of connecting up to 8 PCBs in a single run, thus allowing for high throughput. The system is highly user-friendly, with an integrated touchscreen that allows for easy navigation and programming of the machine. Furthermore, an intuitive graphical user interface (GUI) provides a graphic representation of the PCB assembly sequence and a real-time graphical feedback of the process. WESTBOND 7200B can handle various types of wire materials such as gold, aluminum, and polyimide. In addition, it is capable of bonding through the board, which makes it suitable for ultra-fine-pitch applications. Moreover, the bonder is equipped with various intelligent features such as wire break testing, real-time process monitoring, autostart capability, and repeatability monitoring capabilities. These features ensure consistent quality and allow the user to monitor the bonding process in real time. 7200B Automatic Wedge Bonder is an ideal solution for high-volume production lines. Its advanced features and user-friendly design make it a reliable, robust, and easy to use machine that delivers consistent quality results with low maintenance costs.