Used WESTBOND 7400iW #9289176 for sale

WESTBOND 7400iW is an advanced automated wire-bonding equipment designed for use in semiconductor packaging and assembly facilities. 7400iW utilizes the latest in ultrasonic, thermocompression, and wedge bond technologies to deliver consistent and reliable bonding results. The ultrasonic system offers two bond heads that enable efficient, symmetrical wire loops. The bonded wire structure can be designed to reduce chip bonding heat and maximize first-pass yields. The unit also provides a real-time weld monitor, which eliminates the need for manual inspection of individual bonds. The thermocompression technology ensures excellent wire attachment strength and uniform bond quality across all wire sizes, while the wedge bond technology can accommodate both round and rectangular wires. WESTBOND 7400iW features an easy-to-use, intuitive LCD panel with user-friendly icons to control various functions and settings. The graphic display of the panel permits the viewer to monitor the operational status of the machine and the parameters that it is operating on. The integrated Ethernet connection and the USB port allow for remote access and data transmission. 7400iW can be easily integrated into production lines, increasing throughput and decreasing operator time. The machine runs with high precision, allowing users to achieve wide repeatability and uniform bond heights. WESTBOND 7400iW has 11 feeders, allowing operators to optimize machine speed and minimize cycle time while maximizing yield. Additionally, the robust mechanization of the tool reduces vibration, improving quality and integrity. 7400iW is the perfect tool for the reliable and efficient assembly of precision wire bonds. This asset provides high-quality bonding results, enhanced throughput, and improved yield, making it the ideal bonder for a wide variety of industrial applications.