Used WESTBOND 7400iW #9359619 for sale

WESTBOND 7400iW is an innovative and reliable thermocompression wire bonding machine designed to meet the most demanding interconnecting and packaging needs in the microelectronics industry. Featuring WESTBOND patented MultiBond™ technology, 7400iW combines wire placement accuracy, wire diameter control, and thermal control in one integrated bonding equipment. WESTBOND 7400iW operates on a precise thermal cycling cycle technology, which provides repeatable bond pairs that are reliable and accurately testable. It is designed with an intuitive user interface and access to advanced logging and viewing capabilities for integral process monitoring and control. It allows for a variety of wire diameters, including ultra fine wire bonding of 0.003" and standard wire bonding of 0.01". The machine features its unique MultiBond™ technology, which is designed to minimize heat losses during the bonding process. This results in maximal energy efficiency, minimal oxidation of materials, and improved bonds. The system also offers optical bond verification as well as automatic wire break quantification, providing the best reliability access in the industry. 7400iW also offers automatic wire placement correction and advanced profiling in a unique turn-key wire bonding unit. With various configuration choices for CCD camera, bonding head, motors, and computer control systems, engineers are provided with the flexibility they need to customize the machine to specific needs. Overall, WESTBOND 7400iW is an innovative, powerful, and reliable thermocompression wire bonding tool designed to meet the needs of modern microelectronics markets. It is the ideal choice for all wire bonding packages and functions, allowing for easy customization and precise control for maximum efficiency and reliability.