Used WESTBOND 7476D #9410725 for sale

Manufacturer
WESTBOND
Model
7476D
ID: 9410725
Wire bonders.
The West Bond WESTBOND 7476D is a mid-range manual die bonder designed to meet the needs of users in a variety of production environments. WESTBOND 7476 D features a fully-documented mechanical design that is robust, highly configurable and easy to use. 7476D utilizes an X-Y-Z motion platform for precise die placement. Controls are conveniently located on the front of the equipment for location, angle, and depth control. The X-Y-Z system is capable of 7.5 Micron / 2.5 micron resolution and a 0.1degree accuracy for angular control. 7476 D can handle substrates up to 4″ in width and various combinations of thickness up to 2″ (50mm). Substrates up to 4.25″ in width or a combination of the substrate's length and width up to 6″ can be easily accommodated. WESTBOND 7476D can process a variety of dies including CSP, BGA, MBGA, QFN, and other flip-chip technologies. It is capable of handling die sizes up to 0.5mm with a maximum die height of 0.4mm. An optional tweezer set is available for development purposes. WESTBOND 7476 D provides a comprehensive adhesive unit. The 3 fluid delivery options include syringe, squirt and vacuum. 7476D's control panel can be used to adjust the adhesive parameters to accommodate the various adhesives being dispensed. 7476 D is available with either a stepper motor driven or motorized motorized motorized X-Y axis. The motorized model offers an improved travel speed and additional features such as threading, repeatability, and soft-stop. WESTBOND 7476D comes with software that enables operators to create and fine-tune processing recipes. The software is simple and intuitive, allowing operators to quickly get up and running with the machine. All in all, the West Bond WESTBOND 7476 D is an efficient and reliable manual die bonder that meets the needs of users in a variety of production environments. 7476D's robust mechanical design, precise motion control, and comprehensive adhesive tool make it ideal for applications in semiconductor, automotive and medical industries.
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