Used WESTBOND 7730E-79 #293636645 for sale

WESTBOND 7730E-79 is a high-performance precision semi-automatic fine-pitch wire bonder that provides superior bonding of wires onto printed circuit boards for a wide range of applications. 7730E-79 is designed to be capable of fine-pitch bonding as small as 0.02 mm, allowing for high-density circuit interconnections and components. This high-performance equipment features a precisely aligned and adjustable head to ensure accuracy in bond position, height, and angle. WESTBOND 7730E-79 is designed with a three-layer manual feeder to simplify loading of dielectric films and wire spools. This allows for quick changes, simplified loading, and improved bond position accuracy. 7730E-79 is also equipped with a Vari-Crimp equipment, a tool head with a variable force mechanism, that provides an optimized and repeatable crimp force on the bond pads. WESTBOND 7730E-79's CCD vision system and advanced software enables fast and accurate manual programming for differentwire bonds or program sets in a variety of bonding coordinates. The user can also store up to 99 different program and bond settings for quick and reliable loading and setup. 7730E-79 is also programmable for up to 120 steps for multiple wire bonds and sequences. WESTBOND 7730E-79 also includes a microcontroller temperature control unit that operates various parts of the equipment including the bonder head, hot bar, wire furnace, and more. This helps to minimize bond force errors due to environmental temperature changes while increasing reliability. additionally, 7730E-79 is equipped with a vibration machine to minimize fatigue and improve operator safety. To further improve productivity, WESTBOND 7730E-79 can be automated with its optional accessories such as the joystick, hot bar, wire furnace, and servo tools. Its user-friendly Windows-based operating tool and graphic LCD display allow for quick setup and efficient troubleshooting. Overall, 7730E-79 offers superior bonding performance, efficient operation, and reliable results for a wide range of higher-density circuit applications. With its integrated safety features, advanced technology and high accuracy, it ensures reliability and repeatability for a wide range of wire bond functions.