Used WK WT-2011 #9155829 for sale

WK WT-2011 is an orbital bonder designed for a wide range of bonding applications. It is a high-precision, low-temperature bonding machine for use in die-attach, wire-stitch, direct-attach, and flip-chip processes. WT-2011 is a portable bonder intended to be used in medium- and high-volume production environments, and has applications in industries such as Light-Emitting Diode (LED) manufacturing, semiconductor device packaging, automotive and aerospace electronics, medical devices, and other applications where precision bonding is required. WK WT-2011 features an adjustable-height X/Y/Z stage that can move a substrate up to 200mm in size. This feature allows for precise positioning of the bonder relative to the substrate, providing the user with accurate alignment for the application. WT-2011 also features a built-in higher-resolution optical microscope with a rotational image plane and a laser-targeting beam for added accuracy and repeatability. WK WT-2011 employs advanced servo-motor technology, and can automatically detect and adjust the force applied to the substrate for optimal bond formation. WT-2011 also offers programmable bonding parameters which can be easily adjusted to fit the specific application, including bonding force, bond type, temperature range, and dwell time. It also offers an advanced vision system that can detect defects on the substrate, as well as a system for monitoring heat and force for additional process control. WK WT-2011 is designed to provide a high-performance, cost-effective solution for the most demanding bonding applications. Its high-precision bonding capabilities, accompanied by a broad range of features, make WT-2011 an ideal choice for a wide range of applications.