Used XYZTEC Condor 100-3 #9248725 for sale

XYZTEC Condor 100-3 is an advanced wire bonder designed for high-volume production of printed circuit board (PCB) assemblies and double-sided assemblies. Condor 100-3 offers high precision and repeatability for applications such as ball-attach, gold-wire bonding, and thermosonic ball-attach bonding. XYZTEC Condor 100-3 is equipped with the latest in wire bonding technology, including a precise 3-axis motorized wire fed head and a 7-axis motion equipment for precision looping and placement. The motion system is capable of forming single and double bond loops and also provides over-travel protection - a feature that helps to minimize wire looping errors. The motion unit is available in three versions: a high-speed version, a high-precision version, and a hybrid version with both high-speed and high-precision capabilities. Condor 100-3 comes equipped with a motorized height-adjustable stage, which offers fast and accurate setup adjustments. The stage also includes semi-automated programmable height scanning for enhanced bond verification and quality control. In addition, XYZTEC Condor 100-3 includes a fully automated wire winding machine with a choice of an ultrasonic wire scissors for precise wire cut-off. The built-in fault-tolerant wire handling tool includes auto-strip, reel-to-reel wire feed, and control mechanisms to reduce manual labor and the risk of errors. Condor 100-3 also features an automatic die-attach asset that eliminates the need for manual handling of the die during loading and unloading operations. XYZTEC Condor 100-3 has an easy-to-use touchscreen controller that can be configured with dedicated software for advanced, quality-controlled wire bonding. Additionally, the model is compatible with PC based software, such as XYZTEC Graphical User Environment (GUE), for controlling the bonder and managing data. To ensure quality, safety, and reliability, Condor 100-3 has built-in troubleshooting and reporting capabilities for easy process monitoring and optimization as well as an automatic process logging equipment for traceable and predictable results. Additionally, the wire bonder has an integrated barcode reader for traceability applications. XYZTEC Condor 100-3 offers reliable and efficient wire bonding for high-volume production of printed circuit board (PCB) assemblies and double-sided assemblies. With a host of advanced features, Condor 100-3 offers maximum flexibility and precision for manual and automated wire bonding operations.