Used XYZTEC Condor 100 #9217634 for sale

XYZTEC Condor 100 is an advanced wafer bonder designed for users who require an efficient yet cost-effective solution to bond various types of substrates. The equipment can handle small wafers with precision down to micron levels, and achieves very low warping. It offers various bonding methods such as thermocompression, thermosonic, thermosonic with ultrasonics, thermal compression with ultrasonics, and inductive thermal compression. The stand-alone design of the system ensures maximum reliability and ease of use. The controls of the software are intuitive and the menu navigation is straightforward. It includes a high-end graphical user interface. The unit includes two independently moveable and precisely controlled x-y-z-t platforms or bonding stages. This allows users to bond two wafers or substrates simultaneously. Condor 100 utilizes a vacuum chuck machine to secure and position wafers. It also includes a proprietary detection tool for substrates. The vision asset helps to automatically detect the substrates' position, shape, type, alignment, and angle. This ensures accurate placement and bonding of wafers. XYZTEC Condor 100 is equipped with a laser-based height measuring model to detect any differences in height. The equipment is environmental friendly and meets the industry's noise reduction laws. The electric and thermal transfer of energy is adjustable, ensuring a precise and repeatable bond process. The low energy consumption and high transmission rate make it economical. Condor 100 also features a built-in cooling system which keeps the unit and bonding environment at the desired temperature range. In addition, XYZTEC Condor 100 is compatible with different industrial tools and languages such as C++, C#, VB, etc. It is also equipped with I/O capabilities for device control. All of these features make the machine ideal for medium- to large-scale production of wafers and substrates. Condor 100 provides users with an efficient and economically viable solution for wafer bonding.