Used XYZTEC Condor 70-3 #293604641 for sale

XYZTEC Condor 70-3 is an advanced bonding equipment designed for fast, reliable production of a wide range of flexible and rigid substrates. Condor 70-3 utilizes heated capillary technology to manufacture components with high throughput and yields up to 96%. It is capable of down to 0.25mm pitch accuracy and surface-mount technology modules can achieve as low as 0.1mm pitch accuracy. XYZTEC Condor 70-3 features a heated capillary, profile-based bond head with a three-axes positioner with a maximum travel of 500mm. With a thermal control capable of +/-2C, the system is well suited to process semiconductor materials with the critical control on temperature. Other unit features include the ability to adjust the ultrasonic process parameters independently on each bond pad to produce a range of bond parameters to meet each application, as well as a fast chip-positioning 3-axis arm with accuracy of 0.01mm and speeds up to 4m/s. Condor 70-3 also includes a comprehensive internal diagnostics machine to ensure proper operation of the machine. Additionally, it is easy to access and maintain with a central view of the full machine. The unique modular design of XYZTEC Condor 70-3 allows individual components of the tool to be upgraded for advancements as time and technology allow. Condor 70-3 is ideal for high-throughput applications, such as the manufacture of RFID chips, cellular phone components, and advances in the MEMS and microelectronics fields. The asset is capable of working with a wide range of leaded and lead-free solders, as well as alloys of Aluminum, Gold, and Copper with precision and accuracy. It is also capable of area array, multi ball, and decal diamond pattern packages in addition to standard chip processing. As a result of its reliable operation, safe operation, flexibility, and technical advances, XYZTEC Condor 70-3 is a top choice for assembly and manufacturing of components that are precision sensitive. The model provides reliable and consistent processing, with high-speed throughput, improved yields, and an array of features that optimize the production process.