Used XYZTEC Condor EZ #9253367 for sale

XYZTEC Condor EZ is a desktop bonder designed for high precision die bonding. It is often used in wafer level packaging, LED packaging, and other die attach applications. It is equipped with the latest in die bonding technology providing cost-effective production and stringent quality control. Condor EZ has a wide-view microscope with a LED light source and a large field of view, providing the user with excellent visibility while bonding. This is beneficial for programming, as well as ensuring that the die is centered on the substrate. The equipment is equipped with advanced image recognition technology, providing the user with the ability to check the die alignment prior to bond camp. XYZTEC Condor EZ has several features which allow it to be used for extremely precise bonds, even when working with very small die sizes. This allows the user to bond with very high picks as low as 0.2 mils, and bond with accuracy of 5 microns. It is equipped with a semi-automatic station, where a pre-programmed bonding technique can be selected and set up with minimal effort. This makes it ideal for production environments. The system operates under intelligent control, monitoring both the position and temperature of the bond at the same time. This feature is beneficial in the production of reliable products as the bond effectiveness is continuously monitored and verified. Additionally, the unit offers a variety of data logging options enabling users to support and improve their process. Condor EZ is designed to be user friendly and provides the user with an intuitive graphical interface. The user accesses information and setting changes quickly and easily. It has an ergonomic design, ensuring that the user can operate it in any working environment. XYZTEC Condor EZ is designed to be an extremely reliable and robust machine, providing years of trouble-free operation in an industrial environment. This innovative tool is the ideal choice for those looking for a reliable bonder, designed to produce quality bonds with maximum precision.