Used XYZTEC Condor EZ #9410693 for sale

XYZTEC Condor EZ is a high-precision bonding equipment ideal for flip chip and advanced packaging operations. The system is equipped with a high-speed optics-based vision unit and an advanced robotic control machine designed to ensure quality placement and accurate placement of components. The tool is capable of delivering the highest repeatability, accuracy and speed required for flip chip and advanced packaging. Condor EZ has been designed with a modular configuration in order to cater for a variety of production requirements as well as to enable easy upgrades as technology changes. It is capable of performing both standard and complex bonding operations, including reflow, pressure, selective die attach and jet soldering. XYZTEC Condor EZ asset is equipped with a robot-controlled vision technology for the accurate placement of individual chips at the desired locations, achieving a precision of up to ±5 μm (x-y plane). The model also offers a unique parallel multi-die attach capability, allowing a maximum of 18 dies to be placed simultaneously on each substrate, allowing for extremely fast and accurate assembly. Condor EZ also features an advanced process control equipment to ensure a consistent and stable assembly process. The system is able to monitor and adjust process variables such as temperature, speed and pressure throughout the bonding process. In addition, the unit offers a wide range of safety features, including a light curtain and enclosures for optimum operator safety. The machine also offers a wide range of advanced automation capabilities including remote access, online tool diagnostics, fiducial camera and auto-teach capability. Overall, XYZTEC Condor EZ is a highly flexible asset that offers superior performance, accuracy and reliability. It is well-suited to a variety of high-precision microelectronics assembly processes and offers exceptional placement precision in a wide variety of substrates and packages. It is designed to meet the increasingly stringent requirements of the microelectronics industry, providing an innovative and cost-effective solution for flip chip and advanced packaging applications.