Used XYZTEC Condor Sigma #9294489 for sale

XYZTEC Condor Sigma
Manufacturer
XYZTEC
Model
Condor Sigma
ID: 9294489
Vintage: 2016
Die shear system 2016 vintage.
XYZTEC Condor Sigma is an advanced and powerful automatic flip-chip bonder that offers precise control of dispensing, metering, and plating processes. Utilizing a unique, non-contact bonding technology, it is capable of handling both mass production tasks and smaller, specialized projects with ease and precision. The equipment uses a 30 kV ion beam product source to perform even the most demanding placement operations. Condor Sigma is built for maximum flexibility, with an automated update of characteristics such as pitch, alignment, clip weight and size, and rotation—allowing the machine to deliver superb performance on any challenge under its scope of operation. Additionally, the bonder can adjust its pitch, height, width, and angle to match the exact needs of the specific application. The non-contact bonding technology of XYZTEC Condor Sigma eliminates the need for complex tooling while ensuring high yields, even at the lowest pitch rates. The sophisticated software and intuitive interface of the system further help to streamline and improve the process. This means less manual intervention and more automation which drastically reduces cycle times and costs. Furthermore, with the software, multiple feeders can be linked and configured to run several process iterations that have the same tooling design in an automated synchronous sequence to increase productivity. This capability also makes it perfect for running multiple sets of components simultaneously and optimizing production. Condor Sigma is also equipped with numerous advanced safety features. It is equipped with E-stop buttons, and all motors and circuit breakers can be manually controlled for maximum security. Additionally, an active laser protection unit, automated vision machine, and fume extraction give the tool extra protection against any potential dangers. In summary, XYZTEC Condor Sigma is an advanced and powerful flip-chip bonder that offers high precision control over numerous processes. With its sophisticated software, non-contact bonding technology, and numerous safety features, it is the perfect bonder for both industrial manufacturing and small-scale projects.
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