Used ZEVATECH / JUKI KD 2077 #9262933 for sale

Manufacturer
ZEVATECH / JUKI
Model
KD 2077
ID: 9262933
Bonder Standard: Left to right (3) Heads Independent temperature control 2012 vintage.
ZEVATECH / JUKI KD 2077 is a fully automated bonder specifically designed for bonding wire and ribbon and has a host of features that make it ideal for use in the electronics manufacturing industry. It features a powerful 0.07 μm copper bonding wire and high-grade ribbon that is capable of providing high performance and quick cycle times. The bonder is able to perform a wide range of functions and is suitable for single or multiple points bonding with wire sizes from 0.08 mm (3 mil) to 0.28mm (11mil). It is also compatible with a variety of materials such as aluminum, gold, and copper. JUKI KD 2077 includes a multi-functional interactive touch panel with manual control and full programmable functions. This allows users to customize the process to their specific requirements and also allows full traceability of all processes. In addition, the bond process is pre-programmed to ensure the highest quality and reliability, saving time and cost. The machine also features an auto-bond capability, allowing the user to select the position and solder quantity of each bond to be made. This simplifies operating procedures as users do not have to manually monitor and adjust the process during a bonding cycle. ZEVATECH KD 2077 is equipped with a range of interchangeable bonding head options, making it suitable for various aspects of the electronics manufacturing process. This includes various wire pullers and feeders as well as wire routing capabilities and variable loop height. This feature is particularly beneficial for applications requiring a high repeatability, such as automated assembly and surface mount technology (SMT). The machine also features a high-resolution vision system, allowing the user to program in positional accuracy to ensure accurate placement of bonds. KD 2077 is designed to provide a high degree of reliability, with an internal microprocessor controlling the bond process and temperature control. It is easy to operate, with a variety of user-friendly features such as auto-tensioning and a removable lock-in bond wire jig. This makes it ideal for high volume and critical applications and ensures that bonds are completed with precision. Overall, ZEVATECH / JUKI KD 2077 is a reliable and cost-effective bonder capable of providing strong and reliable connections for a wide range of applications. Its range of features and advanced control capabilities make it an ideal choice for the electronics manufacturing industry.
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