Used JEC / JAPAN ENGINEERING COMPANY ATML-Z-E41Z #9399992 for sale

JEC / JAPAN ENGINEERING company ATML-Z-E41Z burn-in equipment is a semi-automated device designed to stress-test electrical and electronic components prior to the final assembly of the device. It has the capability to test a wide range of components including such as transistors, semiconductors, integrated circuits and optoelectronics. JEC ATML-Z-E41Z burn-in system is designed for use within research and development, manufacturing, and production environments. JAPAN ENGINEERING company ATML-Z-E41Z burn-in unit consists of four main components: the burn-in chamber, the electronic control unit (ECU), the test interface, and the test head. The burn-in chamber is the main body of the device, housing the components and connections. It has adjustable temperature settings adjustable from 0-100°C. The side panel of the burn-in chamber can be opened to place the components under test, or to remove the burned-in components. The Electronic Control Unit (ECU) is the central computer machine, which contains the necessary hardware and software to control the burn-in chamber. It also includes an onboard storage tool for both user settings and measured data. The test interface connects between the ECU, the test head, and the components to be tested. The test head, which is placed at the end of the test interface, connects to the components under test, and provides the necessary power required for the burn-in process. ATML-Z-E41Z burn-in asset is designed to be extremely versatile, allowing users to programulate specific temperature and voltage settings and current limits. The model also includes features such as monitoring variable voltage ranges, timing systems and periodic pulsing capabilities. Additionally, the burn-in equipment is able to detect any undesired changes or faults in the components being tested, allowing the user to make immediate adjustments before proceeding with the burn-in process. JEC / JAPAN ENGINEERING company ATML-Z-E41Z burn-in system ensures that components are of a high quality prior to being placed into the final assembly. Its versatility and advanced capabilities make it a valuable tool for research, development and production within the electronics industry.