Used AMAT / APPLIED MATERIALS B6 MaxEdge #9012212 for sale
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ID: 9012212
Wire saws
Work piece dimensions (L x W):
Max. 4 x 156 mm x 156 mm
Max. 2 x 220 mm x 220 mm
Loading length: max. 4 x 540 mm
Wire speed: 20 m/s
Wire acceleration: 3.5 – 13.5 m/s2
Wire guide length: 560 mm
Wire guide diameter: 300 mm
Number of wire guides: 4
Wire guide power: 4 x 46 kW
Table:
Total table travel (depends on clamping): max. 250 mm
Cutting speed: 0 – 9000 μm/min
Fast table speed: 0 – 460 mm/min
Number of tables: 2
Wire:
Wire tension: 10 – 30 N
Wire length: max. 2 x 1100 km
Wire web width: max. 540 mm
Slurry:
Tank capacity: 700 liters
Pumping capacity: max. 2 x 160 kg/min
Pump power: 3 x 7.5 kW
Pumping speed adjustments: 0 – 100%
Number of pumps: 2 for slurry delivery, 1 for slurry return
Number of manifolds in slicing room: 6
Utilities:
Air pressure / Air flow: 4 – 6 bar / min. 30 m3/h
Exhaust flow: 1 x 250 m3/h
Cooling unit power: 200 kW
Incoming water temperature / Flow (without cooling compressor): max. 15 °C / 24.6 m3/h
Electrical frequency: 50 or 60 Hz
Average power (without cooling compressor): 130 kVA
Maximum power (without cooling compressor): 280 kVA.
AMAT / APPLIED MATERIALS B6 MaxEdge Equipment is a highly advanced crystal growing, sawing, and slicing system, designed for optimal efficiency and precision. The unit combines several innovative technologies, such as precision lithography, crystal growth, laser cutting, and other powerful features to produce the highest quality crystals possible. The machine utilizes a proprietary crystal growth process that effectively harnesses the latest advances in micrometer and nanometer-scale material synthesis and processing. Precision lithography is used to deposit hard masks in the form of precise patterns on the wafer surface, governed by a set of user-defined parameters. The lithography then self-aligns to the desired architecture, before a focused laser sweeps across the coating to precisely trenches the mask in one single operation. The laser is then followed by a proprietary formation-scanning stage. This stage facilitates etching of the crystal material into specific geometries, producing slabs, pillars, and other structures with very high precision. After etching, the mask is then lifted off the wafer to reveal the 3D structures in their pristine condition. AMAT B6 MaxEdge also supports a variety of slicing and dicing capabilities. Its integrated slicing station enables precise cutting of materials for mechanical slicing, while its integrated saw enables cutting of materials into bars, pellets, and other shapes. Its dicing station then performs the final step in the process, providing highly accurate cutting of delicate materials into thin wafers. To top it all off, APPLIED MATERIALS B6 MaxEdge provides advanced control over every step of the process. Its high level of automation enables dynamic control over the crystal growth processes, lithography, etching, slicing and dicing, so that the user maintains full control of the process. This extreme level of control allows the production of materials with the most advanced properties and features.
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