Used DISEC DEWS-0134S #293667209 for sale

DISEC DEWS-0134S is a professional grade crystal growing, sawing, and slicing equipment that is capable of achieving high yields of single-crystal or polycrystalline ceramic components without the need for high-cost laser cutting or grinding process like the alternatives. DEWS-0134S has become the system of choice for many industrial and academic users, including for use in research, development and industrial applications. The unit features two cutting heads with a combined table area of approximately 3,000 X 1,200 mm, each head is oscillated by a motor-in-head servo mechanics that can move with respect to the main table in all three axis — X, Y and Z — in order to finely adjust the cuttings. The drive motor is fixed onto the top of the head for space efficiency and also it offers a great thermal stability. The cutting head has an independent pressure and timer monitoring machine, with capability of time, pressure & material thickness control and quality assurance feature. DISEC DEWS-0134S also includes a fully automated anti-collision tool for easy positioning on brittle materials, such as quartz, sapphire and silicon. The high-performance lapping and polishing asset is equipped with two separate vacuum tables with 24'' diameter top plate and it is used especially for lapping and polishing the single-crystal substrates. Additionally, the model is also equipped with the "SUBCONTR", a tool for sub-micron wafer slicing. The equipment is driven by a powerful PLC and operates with a Windows-based graphical user interface (GUI). It offers comprehensive programming features, with powerful factors, such as variable looping, memory access, data storage, quality assurance, and alarm. All 5 axis motion control and process parameters are customizable for precise and repeatable processes . Finally, the system is designed to optimize the crystal growing process, ensuring a consistent operation and maximum yield for each material cut.