Used HCT EY02 #61022 for sale

HCT EY02 is a crystal growing, sawing and slicing equipment designed for the study of single crystals and for the production of thin slices for research and industrial applications. The system is suitable for cutting and slicing a wide range of materials including Si, GaAs, InP, Sapphire and other materials in wafer form or in the form of pieces. EY02 unit consists of a Crystal Growing (CGS) chamber, a sawing chamber and a slicing chamber. The CGS chamber allows the user to grow single crystal materials through the LPE (Liquid-Phase Epitaxy) and VPE (Vapor-Phase Epitaxy) production processes. The CGS chamber offers different process options such as substrate heaters, two-zone temperature control and closed loop circulation for precise process parameters. The sawing chamber is equipped with a 5-axis diamond wire saw to provide the fastest, cleanest and most cost-effective cutting of hard and brittle materials such as Si, GaAs and InP. The sawing chamber is fully automated and offers the user the flexibility to cut wafers or other pieces of crystals into desired shapes or sizes with the minimum of downtime. The saw blade cutting speed and direction are adjustable and the wire tension can be set to achieve the desired accuracy of cutting. Finally, the slicing chamber is equipped with a precision slicing stage to provide high-precision cutting of ultra thin slices of Si and compound semiconductor materials for advanced research and industrial applications. The slicing stage is capable of dynamic positioning for a wide range of slicing angles, thicknesses and chamfers. The automated cutting head allows both horizontal and vertical slices to be produced. HCT EY02 machine is an ideal solution for research laboratories and production facilities looking to grow and cut single crystals into wafers or slices for further analysis. It offers the user a reliable and cost-effective solution for producing high-quality thin slices for advanced research and industrial applications.