Used KOMATSU NTC MWM 442DM #293638053 for sale

ID: 293638053
Vintage: 2010
Wire saw Maximum wire speed: 1000 m/min Copper wire speed: 2-10 sec Copper wire round trip cycle: 3 cycles / min Drop cutting method Feed speed: 0.1-2.5 mm/min Power supply: 220 V 2010 vintage.
KOMATSU NTC MWM 442DM crystal growing, sawing and slicing equipment is a fully automated system designed for the growth and cutting of high quality quartz, silicon and semiconductor materials. The unit combines precision machinery, advanced software and vacuum-controlled optical components to provide an efficient solution for the production of large numbers of crystals or wafers with high quality and precision. The machine features a fully automated crystal growing and cutting process that can be programmed and managed from a remote computer. It has three primary components: a crystal growth chamber, a sawing chamber and a slicing chamber. Each chamber is sealed and isolated from the other two, with quartz components providing an air-tight seal. The crystal growth chamber is equipped with a precise quartz seed installation unit that enables automated loading of the seed onto the holder. The precise growth process is controlled by a software that monitors and adjusts the environment parameters, such as temperature and pressure, to ensure a consistent rate of growth. Precise sawing is also managed by the software, allowing precise settings and cutting accuracy to be set. In the sawing chamber, the quartz blocks produced in the growth chamber are pre-cut along a pre-programmed line by a high-precision saw blade. The blade can be programmed to accomplish a variety of tasks, from standard cuts to complicated angles and angles of incidence. Pre-slicing is also carried out in the sawing chamber, other directions of desired widths being machined accurately and reliably, before moving to the slicing chamber. In the slicing chamber the final machining is performed using a laser beam that is precisely passed over the surface of the quartz block to slice it into wafers with a thickness and accuracy of up to 0.5 microns. The cutting of the quartz is monitored by software and a special jig. The end result of the tool is perfectly cut crystals and wafers with a very high level of accuracy and precision. KOMATSU NTC MWM-442DM asset is designed to be reliable and efficient, with minimal downtime and a low cost of ownership. It is the perfect tool for any application that requires high quality quartz, silicon or semiconductor crystal materials.
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