Used KOMATSU NTC MWM6500SS #169103 for sale
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ID: 169103
Multi wafer maker
Specifications:
Material: mono-ingot (mono-crystal silicon)
Size of ingot: 156 x L500mm x 4 pieces
Slice thickness target: 200 or 220 um
Center thickness: ±10 um
Thickness TV9: 200 or 220 um ± 20 um
Sori: <50 um
Power: 3Ph, AC220V, 60Hz
Air compressor capacity:
Pressure: >0.4MPa
Flowrate: 900 NL/min
Water cooled:
Cooling water temperature: 12°C ± 2°C
Cutting conditions:
Slurry: glycol-based
Abrasive grid size: GC# 1000
Cutting time: 588 minutes
Wire diameter: 0.14 mm
Wire speed: 800 m/min
Cycle: one way
Unit speed: 300 um/min
Includes:
Computer-controlled wire delivery and winding system
Wire tension control mechanism
Automatic wire withdrawal
~2008 vintage.
KOMATSU NTC MWM6500SS is an advanced crystal growth, sawing and slicing equipment designed to yield high-precision optical components that meet the needs of the most demanding of applications. This system incorporates a modular design which allows the user to tailor the crystal growth specifications to the desired size, shape and design by providing the best available growth conditions. The unit also provides the highest possible levels of cutting performance, preferential growth and slicing accuracy, making it ideal for the production of optoelectronic components such as lasers, LED's and semiconductors. NTC MWM6500SS crystal growing, sawing and slicing machine includes a work chamber which allows for a high level of control over the environment present during the crystal growth process. This includes a vacuum tool for controlling particle concentrations, temperature, oxygen content and other parameters essential for successful crystal growth. In addition, the asset includes a temperature regulation model for controlling the crystal growth temperature range. To ensure maximum production efficiency and consistent high-quality products, KOMATSU NTC MWM6500SS utilizes an advanced positioning equipment capable of recognizing and automatically aligning multiple crystal slabs within a single growth cell. The system also has an inbuilt auto-centering feature in addition to a high-end optical sensing unit which is used to align the diamond blade on the desired cutting line. The sawing and slicing process of NTC MWM6500SS is powered by a high-precision, diamond blade capable of making curved, angled and other intricate cuts with an extraordinary degree of precision. The sawing and slicing process can be completed in as little as one second and with the aid of the machine's integrated camera vision machine and embedded software, the team can even recognize markings or discrepancies on the crystal and accurately adjust the cut accordingly. KOMATSU NTC MWM6500SS is an ideal choice for those seeking high-quality optoelectronic components; with its optimized crystal growth, sawing and slicing technology, the tool is capable of producing components with a near perfect symmetry and form. This asset's advanced features and stellar performance allows for increased production times, improved cost-effectiveness and, ultimately, higher customer satisfaction rates.
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