Used MEYER BURGER BrickMaster BM 860 #293778174 for sale

MEYER BURGER BrickMaster BM 860 is a multi-functional crystal growing, sawing and slicing equipment. This system is used to grow, cut and process large-scale wafer blocks, most commonly for use in the semiconductor industry. The unit is designed to provide high quality slicing and sawing of large wafer blocks, with high precision and repeatability. The BM 860 machine features a fully automated crystal growing chamber with independent temperature and gas control, for producing high quality single crystallinity. The tool then moves crystal blocks to the sawing and slicing station, equipped with a sharp diamond blade with water cooling, to produce high performance wafers. The BM 860 also features an advanced, high-precision control asset that utilizes a three-dimensional vision model to precisely guide the cutting direction and speed. This allows the equipment to produce wafers with perfect overall form and edge accuracy, as well as eliminating any risk of wafer breakage. The system is also capable of slicing a variety of materials, including silicon, III-V, and II-VI materials. The MM 860 unit utilizes a number of technologies to guarantee the quality of the produced wafers, such as laser interferometry for micro precision control, adjustable saw speed for maximum quality, advanced imaging and prober software for data acquisition, and a computer numerical controller (CNC). Additionally, the BM 860 is equipped with an optical microscope to provide a top view of the slice, allowing accurate real-time measurements of the slice and showing any defects or variations in the slice's quality. The BM 860 is an essential tool for producing high-quality crystals, wafers and slices. It is a great choice for achieving precise and repeatable results with fast turnaround times. The machine is easy to use, reliable and provides optimum yields.