Used MEYER BURGER BS 810 #198391 for sale

MEYER BURGER BS 810 is a highly advanced crystal growing, sawing and slicing equipment designed to automate the processes of wafer fabrication. This system utilizes a unique CVD/PECVD coating unit as well as a multi-chamber atmospheric pressure chemical vapor deposition (APCVD) furnace to provide uniform and reliable crystal growth. The machine is capable of growing crystals of different shapes and sizes, sawing and slicing them into wafers and automatically polishing the surface of these wafers. BS 810 utilizes precise temperature and gas flow control technologies to ensure precise crystal growth and slicing. It is equipped with advanced onboard computers, allowing precise adjustment of power, temperature, speed and gas flow settings during crystal growth. The tool also features a digital imaging asset for testing and analyzing the growth progress and allows for precise simultaneous slicing of multiple wafers. Additionally, the model provides advanced CVD coating technologies to increase wafer size and resistivity. MEYER BURGER BS 810 features multiple-tools robotic arms that enable automated cutting, slicing and polishing of the wafers. The robotic arms are designed for single or multi-head slicing and can manage, load and unload wafers from the equipment. The robotic arms can also carry out precise polishing and deburring processes on the wafers. The robotic arms are made from corrosion-resistant materials and feature an incorporated fail-safe mechanism to ensure the accuracy of the cutting process. BS 810 is also equipped with an automated handling system, which enables efficient loading and unloading of the wafers. The unit can be customized with a range of wafer conveyors, carousels and various transfer mechanisms. This automated handling machine helps reduce loading and unloading time while increasing accuracy and repeatability throughout the crystal growth, sawing and slicing process. MEYER BURGER BS 810 is highly reliable and efficient, providing a complete solution for crystal growth, sawing and slicing of wafers. The tool's precise temperature and gas flow control, advanced CVD coating technologies, automated robotic arms and automated handling asset ensure an accurate and repeatable process. BS 810 is an ideal choice for a wide variety of applications where precise crystal growth, sawing and slicing are required.