Used MEYER BURGER DS 264 #293646068 for sale

MEYER BURGER DS 264 is a crystal growing, sawing and slicing equipment designed to meet the stringent requirements of the semiconductor industry. The system is capable of supplying consistent high-quality crystal substrates which are used widely in the manufacture of high-tech electronics. DS 264 is a combined unit that uses the Czochralski (Cz) method and Direct Laser Diode (DLD) method to create the required crystal substrates. The machine first creates a homogenous melt of the raw material, whether it is a single element or multi-element alloy, in a dual crucible arrangement. The melt is then agitated to homogenise it before the Cz puller is activated to draw off crystal material from the melt and create the substrate. The DLD tool is capable of maintaining the shape and size of the crystal during growth with its laser diode beam. The crystal is then cut into wafers using focused ion beam (FIB) milling. Using the FIB beam, the asset is able to accurately cut the crystal in the desired shape and size. When the crystal has been properly cut and the desired thickness has been achieved, the model is then capable of slicing the crystal into individual wafers. These wafers are then ready to be used in high-tech electronics manufacturing. MEYER BURGER DS 264 is famed for its reliability, accuracy and superior control. The equipment is capable of producing wafers with excellent material properties and surface qualities. The system's ability to precisely control the growth parameters of the crystal ensures that the wafer substrates produced are of the highest quality and will meet the exacting standards demanded by the semiconductor industry. DS 264 is easy to use and maintain. Its intuitive user interface allows the user to work with the unit effectively. Regular maintenance can keep the machine working optimally and ensure that the machine is supplying substrates with perfect consistency. MEYER BURGER DS 264 is an advanced, technically impressive crystal growing, sawing and slicing tool. It is capable of producing high-quality crystal wafer substrates that are used in the manufacture of high-tech electronics and other devices. The asset is reliable and easy to use, ensuring that the user always gets the required results.