Used MEYER BURGER DS 265 #9246125 for sale

MEYER BURGER DS 265 is a crystal growing, sawing and slicing equipment. It is a fully automated solution that increases productivity and provides top-notch quality in crystal fabrication. This system can grow, saw and slice wafers made of crystalline silicon or other similar materials. MEYER BURGER DS-265 enables crystal growers to produce top-grade single crystal substrates with excellent structural quality. It also has a built-in slicing station to perform high-precision slicing and chamfering of single crystal substrates. The unit's growing machine uses a high temperature silicon melt process with diamond pulling mechanism and a highly precise control tool. This ensures that the substrate is suitable for the subsequent sawing and slicing steps. The sawing station allows for sawing with hard quartz or soft rubber blades. This station is equipped with high feed rates for both sawing and slicing, for higher productivity and faster delivery times. The slicing station employs a laser-controlled cutting technology that utilizes a quartz laser filament. The asset is equipped with automated handling systems for obtaining higher slicing efficiency. The model is fully automated, which means that all processes are completed without manual intervention. This minimizes the risk of contamination, cross-contamination and downtime. It also provides automatic calibration of the laser and the parameters of the diamond saw blades to ensure optimum results. DS 265 is suitable for use in automated fabrication and laboratory environments. It is capable of producing single crystal substrates with a thickness range of (200-500µm). It is an all-in-one solution that simplifies the production process and maximizes output. This equipment is robust and reliable, offering excellent quality and operational reliability even in complex fabrication processes. It is ideal for applications where high performance and precision are critical.