Used MEYER BURGER DS 271/1 #293778218 for sale
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ID: 293778218
Multi wire saw
Workpiece
Length: Maximum 1.020 mm
Cross-section: 156 mm x 156 mm (Typical)
Maximum: 210 mm x 210 mm
Work pieces: 2 x 510 mm / 4 x 255 mm
Wafer thickness: Up to 160 pm (Typically 180 - 200 pm)
Wire:
Wire speed: Programmable up to 20 m/s
Wire diameter: 100 - 160 pm
Acceleration: Up to 2 m/sec
Wire direction: Forward or reverse cutting
Cycle time: Programmable (Forward and backward)
Wire guide rollers:
(2) Rollers
Required power: 2 x 100 kW
Horizontal distance: 660 mm (Between axes)
Wire web:
Wire web width: Maximum 1.030 mm
Wire deflection rollers
Diameter: 160 mm
Number: 2x3 (6)
Wire bonder:
MC Spool: MB 500
Supplier spool: TA 100 am TA 180
Cutting feed:
Speed: 0.01 - 10 mm/min
Rapid traverse: 200 mm/min
Working stoke: Maximum 270 mm
Slurry system:
Tank capacity: 475 litres
Pump delivery rate:
Adjustable
Measured
Displayed by mass
Flow meters
Slurry density: Displayed
Slurry cooling: Heat exchanger
Control system:
PLC (Industrial PC, SIEMENS S7)
Operator panel: Flat panel touch screen, 15".
MEYER BURGER DS 271/1 crystal growing, sawing and slicing equipment is a sophisticated piece of equipment designed to help manufacturers produce precision crystals for industrial use. It combines both standard and advanced techniques to provide cost-effective and accurate production of crystals. The system is composed of two core components: a crystal seed growing apparatus and a cryo-slicer. MEYER BURGER DS 271-1 crystal seed growing apparatus is a highly optimized unit designed to quickly produce quality crystals. It features a compact construction and can be operated by a single user. The machine utilizes a temperature gradient that creates consistent, high-quality crystals. It is capable of producing samples that are approximately27mm in diameter with a specification tolerance of +/- 10%. It operates at a maximum temperature of 2500°C and can be centered on a variety of crystals including quartz, gallium arsenide and lithium tantalate. The tool also includes a cryo-slicer for cutting and slicing the grown crystals. This offers a unique approach to slicing and dicing crystals, utilizing high-pressure cooled jets of gas and liquids to quickly, accurately and reliably cut the crystals into circles, squares, and rectangles of exact dimensions. The asset also offers the ability to engrave semi-conductor dies onto the crystal. DS 271/1 crystal growing model is a powerful and precise solution for industrial cutting and slicing needs. It is capable of rapidly producing top quality crystals, and offers speed and accuracy that is unmatched in its price range. With its integrated components, it can be easily set-up, operated and maintained without complex training. The equipment also features built-in safety features, ensuring a safe working environment for the operator. With its various capabilities, it can offer manufacturers the greatest efficiency and cost-effectiveness without sacrificing quality.
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