Used MEYER BURGER DS 271/1 #9194281 for sale

MEYER BURGER DS 271/1
ID: 9194281
Vintage: 2010
Multi wire saw Workpiece Length: Maximum 1.020 mm Cross-section: 156 mm x 156 mm (Typical) Maximum: 210 mm x 210 mm Work pieces: 2 x 510 mm / 4 x 255 mm Wafer thickness: Up to 160 pm (Typically 180 - 200 pm) Wire: Wire speed: Programmable up to 20 m/s Wire diameter: 100 - 160 pm Acceleration: Up to 2 m/sec Wire direction: Forward or reverse cutting Cycle time: Programmable (Forward and backward) Wire guide rollers: (2) Rollers Required power: 2 x 100 kW Horizontal distance: 660 mm (Between axes) Wire web: Wire web width: Maximum 1.030 mm Wire deflection rollers Diameter: 160 mm Number: 2x3 (6) Wire bonder: MC Spool: MB 500 Supplier spool: TA 100 am TA 180 Cutting feed: Speed: 0.01 - 10 mm/min Rapid traverse: 200 mm/min Working stoke: Maximum 270 mm Slurry system: Tank capacity: 475 litres Pump delivery rate: Adjustable Measured Displayed by mass Flow meters Slurry density: Displayed Slurry cooling: Heat exchanger Control system: PLC (Industrial PC, SIEMENS S7) Operator panel: Flat panel touch screen, 15" Option: Slurry-management: Interface profibus DP/DP-coupler MES-lnterface: XML Remote access: VPN Via local ethernet TCP network 2010 vintage.
MEYER BURGER DS 271/1 is a state-of-the-art crystal growing, sawing and slicing equipment with the latest in automation technology incorporated. It is designed to be both highly efficient and economical in its operation and its overall performance has met with consistent customer satisfaction. MEYER BURGER DS 271-1 is capable of producing the perfect single crystalline wafers each and every time. This is made possible by the use of a unique polymer thermal-conduction technique that promotes uniform heating of the wafer. The wafers are then further processed with the use of precision saw blades, which can cut the samples into slices of any desired thickness. The saw blades are computer controlled and enable the user to make precise, accurate cuts with repeatable, reliable results. The system also incorporates a high temperature crystal growing chamber. This makes it ideal for the production of a variety of crystals, such as ZnO, SiC, GaAs, and GaN, among others. Within this chamber, the temperature can be tightly controlled and used in the production of perfect single crystalline layers over a wide variety of substrate materials. DS 271/1 has a number of features that make it particularly attractive to customers. For one, it is easy to operate and setup, and offers a number of user friendly features to help with operation. Additionally, its excellent performance and highly efficient operation make it an economical machine to own and operate. This combined with its easy automation, low maintenance costs, and speedy throughput make it a must have for crystal growers and researchers alike. The performance of DS 271-1 is also monitored by its built-in diagnostic unit, which includes various sensors and indicators to ensure the machine is operating correctly and efficiently. Its modular design also allows it to be easily upgraded and reconfigured to accommodate changing needs and current technology. Through its advanced capablities, MEYER BURGER DS 271/1 is able to produce large, defect-free wafers for a variety of applications. Overall, MEYER BURGER DS 271-1 is a respected and reliable machine for crystal growing, sawing, and slicing. It offers state-of-the-art technology combined with superior automation and cost effectiveness, which makes it an ideal choice for those looking for reliable performance and a cost conscious solution.
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